A highlight is the first x86 based COM-HPC Server modules based on the brand-new Intel Xeon D 1700 processors. These modules are specifically designed for workload consolidation servers in vision enabled autonomous vehicles as well as video infrastructures for safety and security offering up to 10 cores in the extended temperature range from up to -40°C to 85°C.
Leveraging the AMD Ryzen V2000 processor on a COM Express compact footprint the conga-TCV2 modules supporting up to 8 cores and 16 threads on a single BGA footprint are great candidates for digitisation and parallel-processed edge analytics – including workload balancing and consolidation enabled by virtual machines on the basis of Congatec’s RTS real-time hypervisor implementations.
For low power designs the ARM Cortex-A72/A53 based conga-SMX8 SMARC 2.0 Computer-on-Modules with NXP i.MX8 processor impress with excellent performance, flexible graphics and numerous embedded features for connected mobility applications. Furthermore, they impress with hardware-based real-time and hypervisor support along with broad scalability as well as resistance against harsh environments and extended temperature ranges.
Stand 05.309
